报告摘要

Recent advancements in microwave materials and processing technologies have sparked growing interest in additively manufactured radio frequency (RF) electronics, particularly in the development of microwave circuits and antennas. These components are reshaping how engineers’ prototype and manufacture electronic devices by enabling rapid design iterations, reducing time-to-market, and lowering production costs. Unlike traditional manufacturing, additive manufacturing allows for in-house, short-run production, offering greater design flexibility while minimising material waste. 3D-printed RF components, such as microwave circuits, lens antennas, electronic sensors, and metasurfaces, are especially valuable in wireless communication and advanced sensing systems due to their customizability and integration potential. Their print-on-demand nature aligns well with sustainable engineering practices, reducing the need for large-scale production and extensive supply chains. This lecture will examine the design, fabrication, and application of 3D-printed microwave and RF electronics as a pathway toward high-performance, customizable solutions. With globale lectronics demand on the rise, adopting environmentally responsible manufacturing methods is crucial. Additive manufacturing supports this shift by promoting green electronics and reducing the industry's environmental footprint. In the era of 5G and beyond, compact and portable 3D-printed devices are poised for widespread adoption across applications requiring customized, eco-friendly designs. These include personal healthcare, wearable electronics, biomedical technologies, medical instrumentation, and space and defense systems. As such, 3D-printed RF technology represents a signifcant step forward in merging technological innovation with sustainability.

个人简介

Yang Yang (M'14-SM'17) was born in Bayan Nur, Inner Mongolia, China and received a PhD degree in Electronic Engineering from the Department of Electrical and Computer Systems Engineering, Monash University, Clayton, Australia,in 2013. In December 2016, Dr. Yang joined the University of Technology Sydney (UTS), Australia. He is currently a FullProfessor and a Group Leader of 3D Millimetre-Wave and Terahertz Circuits and Antennas in UTS Tech Lab. His research interests include additively manufactured electronics, millimetre-wave and sub-terahertz technologies in 5G and beyond and biomedical applications. He has over 300 international publications in microwave, millimetre-wave and terahertz circuits and antennas.
   Dr Yang is the Australian Research Council Mid-Career Industry Fellow (2025-2029). Hewas selected as one of the “Top 2 % Most Highly Cited Scientists by Stanford”every yearsince 2019. He received many distinguished awards, including the 2025 Advanced MaterialsInnovation Award by the International Association of Advanced Materials (IAAM), 2024IEEE MTT-S IMS First Place in the Early Career Award Competition (serving as the ECRadvisor), 2023 lEEE NSW Section Outstanding Service Award, 2023 EEE AP-S OutstandingChapter Award and 2022 1EEE MTT-S Outstanding Chapter Award. He is an Associate Editorof IEEE Transactions on Microwave Theory and Techniques (from October 2022), anAssociate Editor of lEEE Microwave and Wireless Technology Letters (from October 2024).a Guest Editor of Proceedings of the lEEE (2024), an Area Editor of Microwave and OpticalTechnology Letters (2019-2024), an Associate Editor of EEE Access (2018-2022), and aGuest Editor of lEEE Antennas and Wireless Propagation Letters (2022). Dr Yang is theInaugural Chair of lEEE MTT-S TC-17 Microwave Materials and Processing Technologies. He is a committee member of IEEE AP-S TC-8 Wireless Communication and IEEE MTT-S TC-28 Biological Efects and Medical Applications. During 2022-2024, he was a committee member of the AP-S Technical Committee on Antenna Measurements and the AP-S Technical Directions Committee. His appointments at IEEE NSW Section, Region 10, include the committee member of the IEEE NSW Section, the Treasurer (2018-2019) and the Chair/ViceChair (2020-2024) of the IEEE NSW AP/MTT Joint Chapter, the Secretary (2019) of IEEENSW PH/ED/SSC/CAS Joint Chapter, the Inaugural Committee/Treasurer (2020) and ViceChair (2022-2024) of IEEE NSW Electron Devices Chapter. He also volunteered in various conference organizing committees, such as the General Co-Chair of the 2025 Australian Microwave Symposium, General Co-Chair (Executive Chair)of the inaugural annual international conference on IEEE Additively Manufactured Electronic Systems (AMES2025) and General Chair of IEEE MTTS International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP 2026).